Dr. Dai attended the 2023 GSA Global Leadership Summit

On June 7, the GSA (Global Semiconductor Alliance) Global Leadership Summit was successfully held at the Shangri-La Hotel in Tokyo, Japan. It was the first time for the summit to back offline since the epidemic. Nearly 150 semiconductor industry leaders from around the world attended to discuss current emerging markets, social responsibility, globalization, industry trends, and the opportunities and challenges facing the industry today.

In the VIP Reception session sponsored by IDH, Dr. Wayne Dai, Chairman, President and CEO of the company, delivered a speech to introduce IDH’s business model and current R&D progress on its chiplet project. He said that IDH’s silicon design service capability and quality were acknowledged by many well-known customers globally. Under the trend of “design-lite” of the IC industry, IDH will continue focusing on technology platform output to further facilitate industry development.